introduction/brief CV
د. عايض القحطاني
أستاذ مساعد، قسم هندسة الحاسب الآلي
publications
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While 3-D integrated circuits (ICs) offer many advantages over 2-D ICs, thermal management challenges remain unresolved. Thermal through-silicon-vias (TTSVs) are TSVs that facilitate heat transfer…
3D stacking of integrated circuits (ICs) provides significant advantages in saving device footprints, improving power management, and continuing performance enhancement, particularly for many-core…
The movement toward 3D fabrication coupled with Network-on-Chip (NoC) aims to improve area, performance, power, and scalability of many-core systems. However, reliability issue as a perpetual…
courses
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This course provides students with basic knowledge on combinational and sequential circuit design. The course includes a lab component to help students get hands-on experience with the theoretical…
This course explores techniques and concepts in applied cyber security. It begins by outlining the fundamentals of cryptography and then introduces emerging cryptography technologies. This course…
This course explores the cybersecurity laws and controls that are established and implemented in order to develop safe practices in organizations today. Based on cybersecurity roles and…