Biosynthesized lincomycin loaded copper oxide nanoparticles using cichorium intybus based thin film spray for enhanced antibacterial and wound healing

مقال فى مجلة

2025

تم النشر فى: https://doi.org/10.1016/j.jddst.2025.107570

Wound infections remain a persistent and significant concern in clinical practice, driving the need for more efficient and targeted therapeutic solutions. This study focuses on the development and evaluation of lincomycin-loaded copper oxide nanoparticle-based film-forming spray (LIN-CuO NPs-FFS) designed to accelerate wound healing. Copper oxide nanoparticles (CuO NPs) were synthesized via a green methodology employing Cichorium intybus extract and optimized using Design Expert software. These optimized nanoparticles were then incorporated into a film-forming spray formulation. Comprehensive in vitro, ex vivo, in vivo, and stability analyses were conducted on both the LIN-CuO nanoparticles and LIN-CuO NPs-FFS. Physicochemical characterization indicated that the CuO nanoparticles possessed an average particle size of 253.1 ± 1.2 nm, a zeta potential of −29.9 ± 0.7 mV, and a PDI of 0.2205 ± 0.098. Upon lincomycin loading, the particle size increased to 294 ± 1.8 nm, with a zeta potential of −30.8 ± 0.7 mV, a PDI of 0.394 ± 0.01, and an encapsulation efficiency of 87 ± 0.2%. The formulation's structural and chemical integrity was verified through UV spectroscopy, XRD, and FTIR analyses. Drug release and permeation studies demonstrated a sustained release pattern and superior skin penetration compared to lincomycin film-forming sprays. Antimicrobial studies confirmed potent antibacterial activity, while in vivoresults highlighted enhanced wound closure, reduced bacterial burden, and improved epithelial regeneration. Furthermore, the formulation remained stable over a six-month storage period. These findings highlight the therapeutic potential of LIN-CuO NPs-FFS, indicating its effectiveness for the topical management of MRSA-infected wounds.

• اسم الناشر: Journal of Drug Delivery Science and Technology